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Reliability Physics and Engineering: Time-To-Failure Modeling

Name: Reliability Physics and Engineering: Time-To-Failure Modeling
Brand: Springer
SKU: 9783319936826
Price: 118.99 USD
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Contributors:

J. W. McPherson

Publisher:

Springer

Binding:

Hardcover

Book Category:

Technology & Engineering, Science

Book Subcategory:

Electronics, Quality Control, Physics

Book Topic:

Circuits

Edition Description:

3rd 2019 Edition

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The product is eligible for a complimentary return within 30 days from the date of purchase. Furthermore, individual items are shipped within 24 hours of receiving the order.

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Specifications +

Release Date:

2019-01-10

ISBN 13:

9783319936826

Weight:

1.87 lbs

Size:

9.21 x 6.14 x 1.06 inches

Pages:

463

Mint Condition +

product description

Description

Provides comprehensive textbook on reliability physics of semiconductors, from fundamentals to applications

Explains the fundamentals of reliability physics and engineering tools for building better products

Contains statistical training and tools within the text

Includes new chapters on Physics of Degradation, and Resonance and Resonance-Induced Degradation.

About the Author

J.W. McPherson is recognized internationally as an expert in Reliability Physics & Engineering. He has published over 200 papers on reliability, authored the Reliability Chapters for 4 Books, awarded 15 patents, and holds the title of Texas Instruments Senior Fellow Emeritus. He was the 1995 General Chairman of the IEEE International Reliability Physics Symposium and still serves on its Board of Directors. In 2004, Joe received the IEEE Engineer of the Year Award from the Texas Society of Professional Engineers. In 2006, he was the Chairman of the International Sematech Reliability Council. Joe is an IEEE Fellow and the Founder/CEO of McPherson Reliability Consulting, LLC. His semiconductor reliability expertise includes device-physics, design-in reliability, wafer-fabrication and assembly-related reliability issues. Several of the reliability models that are used today in the semiconductor industry are closely associated with his name.

Reliability Physics and Engineering: Time-To-Failure Modeling

Description

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