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Reliability Physics and Engineering: Time-To-Failure Modeling

Reliability Physics and Engineering: Time-To-Failure Modeling - Hardcover

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Availability:In StockContributor:J. W. McPhersonPublish date:2019-01-10Pages:463
Language:EnglishPublisher:SpringerISBN-13:9783319936826ISBN-10:3319936824UPC:9783319936826Book Category:Technology & Engineering, ScienceBook Subcategory:Electronics, Quality Control, PhysicsBook Topic:CircuitsSize:9.21 x 6.14 x 1.06 inchesWeight:1.8717Product ID:SCR8M4FDHZ

Provides comprehensive textbook on reliability physics of semiconductors, from fundamentals to applications

Explains the fundamentals of reliability physics and engineering tools for building better products

Contains statistical training and tools within the text

Includes new chapters on Physics of Degradation, and Resonance and Resonance-Induced Degradation.

Language:EnglishPublisher:SpringerISBN-13:9783319936826ISBN-10:3319936824UPC:9783319936826Book Category:Technology & Engineering, ScienceBook Subcategory:Electronics, Quality Control, PhysicsBook Topic:CircuitsSize:9.21 x 6.14 x 1.06 inchesWeight:1.8717Product ID:SCR8M4FDHZ

J.W. McPherson is recognized internationally as an expert in Reliability Physics & Engineering. He has published over 200 papers on reliability, authored the Reliability Chapters for 4 Books, awarded 15 patents, and holds the title of Texas Instruments Senior Fellow Emeritus. He was the 1995 General Chairman of the IEEE International Reliability Physics Symposium and still serves on its Board of Directors. In 2004, Joe received the IEEE Engineer of the Year Award from the Texas Society of Professional Engineers. In 2006, he was the Chairman of the International Sematech Reliability Council. Joe is an IEEE Fellow and the Founder/CEO of McPherson Reliability Consulting, LLC. His semiconductor reliability expertise includes device-physics, design-in reliability, wafer-fabrication and assembly-related reliability issues. Several of the reliability models that are used today in the semiconductor industry are closely associated with his name.


Publisher: Springer

Edition

3rd 2019 Edition

Contributor(s)

J. W. McPherson

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