System on Package: Miniaturization of the Entire System - Hardcover
by Rao Tummala
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Languages:EnglishPublisher:McGraw-Hill CompaniesISBN-13:9780071459068ISBN-10:71459065UPC:9780071459068Book Category:Technology & EngineeringBook Subcategory:Electrical, Electronics, TelecommunicationsBook Topic:MicroelectronicsSize:9.30 x 7.60 x 1.40 inchesWeight:3.08Product ID:SCR728A76J
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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Languages:EnglishPublisher:McGraw-Hill CompaniesISBN-13:9780071459068ISBN-10:71459065UPC:9780071459068Book Category:Technology & EngineeringBook Subcategory:Electrical, Electronics, TelecommunicationsBook Topic:MicroelectronicsSize:9.30 x 7.60 x 1.40 inchesWeight:3.08Product ID:SCR728A76J
Dr. Rao Tummala (Atlanta, GA) is Pettit Chair Professor and Director of the Packaging Research Center at Georgia Tech. He is a past-President of ISHM, an IEEE Fellow, and the General Chair of IEEE-ICTC. He was recently named by Industry Week as one of the 50 Stars in the US for improving national competitiveness.
Publisher: McGraw-Hill Companies
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