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Materials for Advanced Packaging

Materials for Advanced Packaging - Hardcover

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Availability:Out of StockContributor:Daniel Lu, C. P. WongPublish date:2008-12-10Pages:724
Languages:EnglishPublisher:SpringerISBN-13:9780387782188ISBN-10:387782184UPC:9780387782188Book Category:Technology & EngineeringBook Subcategory:Electronics, Nanotechnology & MEMS, Materials ScienceBook Topic:Microelectronics, Electronic MaterialsSize:9.77 x 6.45 x 1.74 inchesWeight:2.59Product ID:SCW9QGHBK5

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. It discusses established techniques, as well as emerging technologies such as digital health, bio-medical, and nano-materials/processing, in addition to microelectronic and optoelectronic packaging. The book therefore provides readers with the most up-to-date developments in advanced packaging.


Languages:EnglishPublisher:SpringerISBN-13:9780387782188ISBN-10:387782184UPC:9780387782188Book Category:Technology & EngineeringBook Subcategory:Electronics, Nanotechnology & MEMS, Materials ScienceBook Topic:Microelectronics, Electronic MaterialsSize:9.77 x 6.45 x 1.74 inchesWeight:2.59Product ID:SCW9QGHBK5
Publisher: Springer

Edition

2009 Edition

Contributor(s)

Daniel Lu, C. P. Wong

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