3D IC Stacking Technology - Hardcover
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Availability:In StockContributor:Banqiu Wu, Ajay Kumar, Sesh RamaswamiPublish date:2011-07-28Pages:544
Language:EnglishPublisher:McGraw-Hill CompaniesISBN-13:9780071741958ISBN-10:007174195XUPC:9780071741958Book Category:Technology & EngineeringBook Subcategory:Electronics, TelecommunicationsBook Topic:Circuits, SemiconductorsSize:9.00 x 5.90 x 0.90 inchesWeight:1.702Product ID:SCW99HMGY6
3D IC Stacking Technology
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The latest advances in three-dimensional integrated circuit stacking technology
The latest advances in three-dimensional integrated circuit stacking technology
With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication...
Language:EnglishPublisher:McGraw-Hill CompaniesISBN-13:9780071741958ISBN-10:007174195XUPC:9780071741958Book Category:Technology & EngineeringBook Subcategory:Electronics, TelecommunicationsBook Topic:Circuits, SemiconductorsSize:9.00 x 5.90 x 0.90 inchesWeight:1.702Product ID:SCW99HMGY6
Banqiu Wu is Chief Technology Officer, TSV and Mask Products Business Group, Applied Materials, Inc. Dr. Wu has published over 50 technological papers in 10 peer-reviewed journals and conference proceedings, and authored/co-authored several books, including Photomask Fabrication Technology and Extreme Ultraviolet Lithography. He holds multiple patents and awards.
Dr. Ajay Kumar is Vice President...
Publisher: McGraw-Hill Companies
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